Robnor Resins PX 700K-1
A medium viscosity high strength epoxy potting compound. Key Features: Good thermal conductivity High electrical…
ELECOLIT® 6603 ( Panacol )
One-part heat cured aluminium oxide filled thermally conductive adhesive Key Features: Slightly flexible Impact and…
CHT EGEL 3000
Low viscosity extremely soft and re-enterable silicone encapsulant. This is designed for the protection of…
CHT AS 1821
This is a single part moisture curing RTV silicone encapsulant. It is self leveling and…
Robnor Resins EL 199 HP
A low viscosity extremely flexible two-part polyurethane potting compound. Key Features: Non-toxic Low embedment stress…
Robnor Resins EL 171 C
Medium viscosity flexible polyurethane potting compound. Key Features: Room temperature cure Low cure Exotherm High…
Robnor Resins EL 116F
Low viscosity flexible two-part polyurethane potting compound. Key Features: Low viscosity Long pot life Low…
CHT SE 2003
Two-part heat curing silicone elastomer encapsulant with high thermal conductivity designed for electronic potting and…
CHT AS 1421
Heat cured silicone encapsulant and adhesive with high thermal conductivity. Suitable for a wide variety…
Robnor Resins PX 439XS
A thermally conductive and flame-retardant epoxy potting and encapsulating compound with a high TG Key…
Robnor Resins PX 439 N
A thermally conductive and flame-retardant epoxy potting and encapsulating compound Key Features: Non-toxic Low shrinkage…
ELECOLIT® 6601 ( Panacol )
One-part heat cured aluminium oxide filled thermally conductive adhesive. Key Features: Very good adhesion to…
Fisnar QuantX Tapered Dispense Tips
Smooth Flow Tapered Tips are plastic tips designed to dispense medium to high viscosity materials…
Fisnar QuantX PTFE-Lined Dispensing Tips
Fisnar PTFE-Lined Dispensing Tips are stainless steel cannula with a PTFE insert lining that projects…
Fisnar QuantX Micron-S Precision Dispensing Tips
Micron-S Precision Dispensing Tips are designed for high accuracy micro-dot dispensing. Micron-S tips have a…
