Hot Melt Potting Compounds
Hot Melts can be fast and easy solution for potting and encapsulating electronic components.
A new manufacturing process has been developed using a black polyamide potting compound that can be dispensed through conventional 12mm (½″) hot melt glue guns. This process has been specifically designed for the electronic, automotive and aerospace industries.
For small scale manufacturing with not very demanding applications this can be a very good alternative to the traditional polyurethane, epoxy and silicone based potting compounds.
Selection of Hot Melt Potting Compounds Products
Hot melt adhesive for electronic potting
Hot melt adhesive for over moulding
