Hot Melt Potting Compounds

Hot Melts can be fast and easy solution for potting and encapsulating electronic components.

A new manufacturing process has been developed using a black polyamide potting compound that can be dispensed through conventional 12mm (½″) hot melt glue guns. This process has been specifically designed for the electronic, automotive and aerospace industries.

For small scale manufacturing with not very demanding applications this can be a very good alternative to the traditional polyurethane, epoxy and silicone based potting compounds.