Potting And Encapsulating
Protecting you device from the ingress of moisture or other materials is very important to ensure a long working life for it.
We offer a full range of potting compounds and encapsulants for protecting your sensitive components from moisture and vibration.
Our Potting And Encapsulating Range
A very high-performance “self-healing” polyurethane resin system.
UV / VIS and thermally curable epoxy resin.
Light curing flexible potting compound with secondary moisture cure.
Hot melt adhesive for electronic potting
Hot melt adhesive for over moulding
Heat cure thermally conductive silicone encapsulant and adhesive.
Low viscosity opalescent polyurethane encapsulant for LED's
Low viscosity optically clear polyurethane encapsulant for LED’s
Low viscosity optically clear silicone encapsulant.
A two-part, low viscosity isocyanate free potting compound.
A two-part, medium viscosity isocyanate free potting compound.
Thermally conductive and flame-retardant epoxy potting and encapsulating compound
Thermally conductive and flame-retardant epoxy potting compound with a high TG
Heat cured silicone encapsulant and adhesive with high thermal conductivity
Two-part heat chemical silicone encapsulant with high thermal conductivity.
Low viscosity flexible two-part polyurethane potting compound
Medium viscosity two-part flexible polyurethane potting compound
A low viscosity extremely flexible two-part Polyurethane potting compound.
Single part moisture curing silicone encapsulant.
Low viscosity extremely soft and re-enterable silicone encapsulant.
Medium viscosity Epoxy potting and encapsulating compound.
Low viscosity unfilled epoxy potting and encapsulating compound
Low viscosity fast curing polyurethane potting compound
