Skip to content 
Low viscosity extremely soft and re-enterable silicone encapsulant. This is designed for the protection of electronic components by providing a very soft but strong encapsulation with excellent vibration resistance. It’s 1:1 ratio also allows for very easy mixing in a production environment.
Key Features:
Base: Silicone
Curing: Two-part Chemical cure
Viscosity: 630 mPas
Thermal conductivity: 0.18 W/mK
You must be logged in to post a comment.
There are no questions yet. Be the first to ask a question about this product.
The LC50FR and LC120FR positive displacement ratio metering, mixing, and
The F4200N.2 is a compact and ergonomically designed bench top
A versatile precision dispenser designed to suit a wide variety
Flexible transparent acrylic coating for the protection of electronic circuitry designed to meet the highest...
Low viscosity, 1-component, condensation curing silicone conformal coating. This can be used on PCB's to...
One-part heat cure silicone thermally conductive adhesive and encapsulant. This material has a particularly fast...
Heat cured silicone encapsulant and adhesive with high thermal conductivity. Suitable for a wide variety...
Unique product with silver grey flecks specifically designed for use on stainless steel splash backs....
RTV curing high thermally conductive silicone adhesive. This is an acetone cured system which is...
This is a single part moisture curing RTV silicone encapsulant. It is self leveling and...
A very high performance “self-healing” polyurethane resin system which is designed for potting delicate electronic...
Optimized by Seraphinite Accelerator
Reviews
There are no reviews yet.