Need Help? Call +353 1 885 0000
CHT AS 1420

CHT AS 1420

One-part heat cure silicone thermally conductive adhesive and encapsulant.  This material has a particularly fast curing time to meet many of the high volume production requirements.

Key Features:

  • UL94V0 approved file Number E334038
  • Adhesion and 3mm cure through at 125°C after only 10 minutes
  • Thermally conductive

Base: Silicone

Curing: One Part heat cured

Viscosity: 43,000 mPas

Thermal conductivity: 1.38 W/mK

product data sheet

CHT Silcotherm brochure

CHT Thermal Interface Materials sheet

Customer reviews

Reviews

There are no reviews yet.

Be the first to review “CHT AS 1420”

There are no questions yet. Be the first to ask a question about this product.

Send me a notification for each new answer.

Supplementary Products

Related Products

Heat cured silicone encapsulant and adhesive with high thermal conductivity.  Suitable for a wide variety...

RTV curing thermally conductive silicone adhesive.  This material is non-corrosive and is particularly suited as...

This is a single part moisture curing RTV silicone encapsulant.  It is self leveling and...

Low viscosity extremely soft and re-enterable silicone encapsulant.  This is designed for the protection of...

Low viscosity optically clear silicone encapsulant.  This material has excellent protection against chemicals, environmental contamination,...

Two-part heat curing silicone elastomer encapsulant with high thermal conductivity designed for electronic potting and...

One-part heat cured aluminium oxide filled thermally conductive adhesive. Key Features: Very good adhesion to...

One-part heat cured aluminium oxide filled thermally conductive adhesive Key Features: Slightly flexible Impact and...

A very high performance “self-healing” polyurethane resin system which is designed for potting delicate electronic...

Shopping Cart
Scroll to Top

Make an Inquiry

TEST POPUP