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CHT AS 1821

CHT AS 1821

This is a single part moisture curing RTV silicone encapsulant.  It is self leveling and non completely non-corrosive and is suitable for the most delicate of electronic applications and will not corrode copper or its alloys.

Key Features:

  • Fast room temp cure
  • Non-corrosive
  • Low linear shrinkage
  • Solvent free

Base: Silicone

Curing: One-part RTV cure

Viscosity: 200,000 mPas

Thermal conductivity: 0.2 W/mK

Product Data Sheet

CHT encapsulant Brochure

CHT Encapsulation and potting materials brochure

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