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CHT SE 2003

CHT SE 2003

Two-part heat curing silicone elastomer encapsulant with high thermal conductivity designed for electronic potting and encapsulating applications.  As a two part system it is also fully resistant to any form of reversion.

Key Features:

  • Room temperature cure
  • Non-corrosive
  • Excellent thermal conductivity
  • Resistant to reversion

Base: Silicone

Curing: Two-Part chemical cured

Viscosity: 35,000 mPas

Thermal conductivity: 1.27 W/mK

product data sheet

CHT Silcotherm brochure

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