Medical Device

Electronics

Industrial dispensing equipment

Hot Melt Guns

Featured Products

Heat-curing modified epoxy adhesive developed for high-performance underfill and structural bonding applications in demanding electronic and industrial environments.

TPO/CMR-free and IBOA-free Medical Grade Adhesive with Fluorescent agent

20 minute open time roller applied Lamination Adhesive

UV-curing adhesive for the fast bonding of many rigid plastics and metals.

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