STRUCTALIT® 8205 is a one-part, heat-curing modified epoxy adhesive developed for high-performance underfill and structural bonding applications in demanding electronic and industrial environments. This solvent-free formulation delivers excellent flowability at elevated temperatures, high thermal stability, and reliable mechanical performance.
Key Features
- Designed for underfill and structural bonding applications
- One-component, solvent-free modified epoxy system
- Excellent flowability at higher processing temperatures
- High glass transition temperature (Tg 130°C)
- Low coefficient of thermal expansion for improved dimensional stability
- High filler content (quartz-filled, 65%) for enhanced mechanical performance
- High mechanical strength and rigidity
- Suitable for precision electronic assemblies and industrial applications
- Stable performance across wide operating temperatures (-40°C to +180°C)
Curing Conditions
Heat curing: 130°C for 15 minutes
Technical Performance Highlights
High hardness (Shore D 90 after cure)
Tensile strength: 33 MPa
Lap shear strength (PCB/PCB): 15 MPa
Compression shear strength (glass/glass): 35 MPa
Young’s modulus: 8000 MPa
Low elongation at break (0.5%) for rigid structural support
Low water absorption (0.2 wt%)
Thermal conductivity: 0.2 W/m·K
CTE: 31 ppm/K below Tg, 79 ppm/K above Tg
Viscosity: 6000 mPa·s (Newtonian fluid)
Density: 1.6 g/cm³
Particle size (D90): 5.9 µm
STRUCTALIT® 8205 is engineered to deliver strong, reliable bonding performance and long-term stability in high-precision applications where thermal and mechanical reliability are critical.
