Skip to content 
Low viscosity flexible two-part polyurethane potting compound.
Key Features:
Base: Polyurethane
Curing: Two-part Chemical cure
Viscosity: 2,000 mPas
Thermal conductivity: 0.35 W/mK
You must be logged in to post a comment.
There are no questions yet. Be the first to ask a question about this product.
An advanced valve controller suitable for use with all Fisnar
The PosiPump™ V-Series Progressive Cavity Valve offers true volumetric meter
The PosiPump™ I-Series Progressive cavity valve offers true volumetric dispensing
The LC50FR and LC120FR positive displacement ratio metering, mixing, and
The F4000 Advance 3-axis bench top robots are designed to
The F4200N.2 is a compact and ergonomically designed bench top
One-part heat cure silicone thermally conductive adhesive and encapsulant. This material has a particularly fast...
Heat cured silicone encapsulant and adhesive with high thermal conductivity. Suitable for a wide variety...
This is a single part moisture curing RTV silicone encapsulant. It is self leveling and...
Low viscosity extremely soft and re-enterable silicone encapsulant. This is designed for the protection of...
Vitralit® UD 8052 F is a one component, no flow, UV/visible light and humidity curing...
Medium viscosity flexible polyurethane potting compound. Key Features: Room temperature cure Low cure Exotherm High...
A low viscosity extremely flexible two-part polyurethane potting compound. Key Features: Non-toxic Low embedment stress...
A very high performance “self-healing” polyurethane resin system which is designed for potting delicate electronic...
Optimized by Seraphinite Accelerator
Reviews
There are no reviews yet.