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CHT AS 1420

Heat cure thermally conductive silicone encapsulant and adhesive.

Heat cured silicone encapsulant and adhesive with high thermal conductivity

Single part moisture curing silicone encapsulant.

Low viscosity extremely soft and re-enterable silicone encapsulant.

Low viscosity optically clear silicone encapsulant.

Two-part heat chemical silicone encapsulant with high thermal conductivity.

Light curing flexible potting compound with secondary moisture cure.

Low viscosity flexible two-part polyurethane potting compound

Medium viscosity two-part flexible polyurethane potting compound

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