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Heat cure thermally conductive silicone encapsulant and adhesive.

Heat cured silicone encapsulant and adhesive with high thermal conductivity

Single part moisture curing silicone encapsulant.

Low viscosity extremely soft and re-enterable silicone encapsulant.

Low viscosity optically clear silicone encapsulant.

Two-part heat chemical silicone encapsulant with high thermal conductivity.

Light curing flexible potting compound with secondary moisture cure.

Low viscosity flexible two-part polyurethane potting compound

Medium viscosity two-part flexible polyurethane potting compound

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