Heat cure thermally conductive silicone encapsulant and adhesive.

Heat cured silicone encapsulant and adhesive with high thermal conductivity

Single part moisture curing silicone encapsulant.

Low viscosity extremely soft and re-enterable silicone encapsulant.

Low viscosity optically clear silicone encapsulant.

Two-part heat chemical silicone encapsulant with high thermal conductivity.

UV / VIS and thermally curable epoxy resin.

Light curing flexible potting compound with secondary moisture cure.

Hot melt adhesive for over moulding

Hot melt adhesive for electronic potting

Low viscosity flexible two-part polyurethane potting compound

Medium viscosity two-part flexible polyurethane potting compound