Heat cure thermally conductive silicone encapsulant and adhesive.

Heat cured silicone encapsulant and adhesive with high thermal conductivity

Single part moisture curing silicone encapsulant.

Low viscosity extremely soft and re-enterable silicone encapsulant.

Light curing flexible potting compound with secondary moisture cure.

Low viscosity flexible two-part polyurethane potting compound

Medium viscosity two-part flexible polyurethane potting compound

A low viscosity extremely flexible two-part Polyurethane potting compound.

A very high-performance “self-healing” polyurethane resin system.

Structalit® 5859 is a heat-curing epoxy adhesive for bonding magnets and stators in electric motors. It provides strong metal adhesion, high-temperature resistance, and a long working life.