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Heat cure thermally conductive silicone encapsulant and adhesive.
Heat cured silicone encapsulant and adhesive with high thermal conductivity
Single part moisture curing silicone encapsulant.
Low viscosity extremely soft and re-enterable silicone encapsulant.
Low viscosity optically clear silicone encapsulant.
Two-part heat chemical silicone encapsulant with high thermal conductivity.
UV / VIS and thermally curable epoxy resin.
Light curing flexible potting compound with secondary moisture cure.
MMA Adhesive designed to meet the requirements of UL94 V-0
Hot melt adhesive for over moulding
Hot melt adhesive for electronic potting
Low viscosity flexible two-part polyurethane potting compound
