Two-part heat curing silicone elastomer encapsulant with high thermal conductivity designed for electronic potting and encapsulating applications. As a two part system it is also fully resistant to any form of reversion.
Key Features:
- Room temperature cure
- Non-corrosive
- Excellent thermal conductivity
- Resistant to reversion
Base: Silicone
Curing: Two-Part chemical cured
Viscosity: 35,000 mPas
Thermal conductivity: 1.27 W/mK
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