This is a single part moisture curing RTV silicone encapsulant. It is self leveling and non completely non-corrosive and is suitable for the most delicate of electronic applications and will not corrode copper or its alloys.
Key Features:
Base: Silicone
Curing: One-part RTV cure
Viscosity: 200,000 mPas
Thermal conductivity: 0.2 W/mK
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