Skip to content 
RTV curing high thermally conductive silicone adhesive. This is an acetone cured system which is solvent free. It cures rapidly to form a very tough rubber and will not corrode copper or any of its alloys and is suitable to be used on printed circuit boards.
Key Features:
Base: Silicone
Curing: RTV cure
Viscosity: 350,000 mPas
Thermal conductivity: 2.3 W/mK
You must be logged in to post a comment.
There are no questions yet. Be the first to ask a question about this product.
A High quality 10″ metal skeleton gun for professional users.
Pneumatic dispenser for 310 ml and 400 ml cartridges of
The F4200N.2 is a compact and ergonomically designed bench top
The VD510 is a diaphragm valve designed for precise flow
A versatile precision dispenser designed to suit a wide variety
A High quality 10″ metal skeleton gun for professional users.
Pneumatic dispenser for 310 ml and 400 ml cartridges of
The F4200N.2 is a compact and ergonomically designed bench top
The VD510 is a diaphragm valve designed for precise flow
A versatile precision dispenser designed to suit a wide variety
One-part heat cure silicone thermally conductive adhesive and encapsulant. This material has a particularly fast...
Heat cured silicone encapsulant and adhesive with high thermal conductivity. Suitable for a wide variety...
This is a single part moisture curing RTV silicone encapsulant. It is self leveling and...
Low viscosity extremely soft and re-enterable silicone encapsulant. This is designed for the protection of...
Two-part heat curing silicone elastomer encapsulant with high thermal conductivity designed for electronic potting and...
One-part heat cured aluminium oxide filled thermally conductive adhesive. Key Features: Very good adhesion to...
One-part heat cured aluminium oxide filled thermally conductive adhesive Key Features: Slightly flexible Impact and...
Optimized by Seraphinite Accelerator
Reviews
There are no reviews yet.