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Elecolit® 6607 is an epoxy resin-based adhesive filled with aluminium oxide. It is a one-component adhesive and due to its flow characteristics, it can be applied by dispenser, screen printing or spatula. Since Elecolit® 6607 cures at temperatures as low as 80°C, even heat-sensitive components can be bonded together. Curing at higher temperatures will shorten the curing

Frame-and-fill processes are used to protect highly complex areas on electronic circuit boards. The process simply is as follows: Step one, a highly viscous barrier – the so-called frame – is applied. Step two, this area is quickly filled with a much lower viscosity filler material – the Fill. With this precise process, areas on

Panacol, Structalit® 5801 is a new 2-component adhesive system that demonstrates exceptional chemical and moisture resistance after accelerated aging.  This resistance makes Structalit® 5801 an ideal material for the structural bonding and potting of electronic components that require the highest level of environmental protection. Structalit® 5801 is a black, 2-component epoxy adhesive system with a

Elecolit® 3647 is a new addition to Panacol’s extensive portfolio of electrically conductive epoxy systems. With a history of demonstrated success, this silver-filled conductive adhesive is particularly suitable for bonding to temperature-sensitive films or flex PCBs.   Elecolit® 3647 is a one-component, silver-filled conductive adhesive that adheres very well to plastics, including polyimide, PC, PVC,