Low viscosity extremely soft and re-enterable silicone encapsulant. This is designed for the protection of electronic components by providing a very soft but strong encapsulation with excellent vibration resistance. It’s 1:1 ratio also allows for very easy mixing in a production environment.
Key Features:
Base: Silicone
Curing: Two-part Chemical cure
Viscosity: 630 mPas
Thermal conductivity: 0.18 W/mK
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