One-part heat cure silicone thermally conductive adhesive and encapsulant. This material has a particularly fast curing time to meet many of the high volume production requirements.
Key Features:
- UL94V0 approved file Number E334038
- Adhesion and 3mm cure through at 125°C after only 10 minutes
- Thermally conductive
Base: Silicone
Curing: One Part heat cured
Viscosity: 43,000 mPas
Thermal conductivity: 1.38 W/mK
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