TECBOND 7718 is a Low viscosity fire retardant polyamide for potting and encapsulating applications in the electronics industry. Tecbond 7718 has a very low viscosity that sets very hard. It is suitable for potting and encapsulation in the electronics industry. Available in amber and black.
Potting and Encapsulation: Tecbond 7718 has been tested for use in electrical / electronic applications. TECBOND 7718 is fire retardant and would meet the UL-V0 flammability rating. The use of hotmelt speeds up assembly as there is no mixing and any unused adhesive remains in the glue gun ready for next time, so there is no waste.
Setting time is usually less than 2 minutes. Coloured versions of the adhesive are available which can be useful to hide components or colour code for traceability.
Key features:
- Simple alternative to two part potting compounds
- Very fast cure time
- Clean to use no mixing required
- Available in amber and black
Packaging: 5 kg box for 15 mm
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