Heat cured silicone encapsulant and adhesive with high thermal conductivity. Suitable for a wide variety of electronic and engineering applications where heat transfer is of the utmost importance.
Key Features:
Base: Silicone
Curing: One Part heat cured
Viscosity: 140,000 mPas
Thermal conductivity: 2.1 W/mK
Certification: UL94 V-0
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Pneumatic dispenser for 310 ml and 400 ml cartridges of
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Pneumatic dispenser for 310 ml and 400 ml cartridges of
The F4200N.2 is a compact and ergonomically designed bench top
The VD510 is a diaphragm valve designed for precise flow
A versatile precision dispenser designed to suit a wide variety
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