Araldite 2014-2

Araldite 2014-2

Gap filling, room temperature curing adhesive, producing very little outgassing when curing, making it ideal for specialised electronics, telecommunication, and aerospace applications. With a high temperature resistance to 120°C and excellent resistance to water and chemicals, the adhesive provides a good bond to a wide variety of substrates.

Key Features:

  • Excellent resistance to water and chemicals
  • Grey Paste
  • High temperature and chemical resistance
  • Gap filling and non-sagging up to 5mm thickness
  • Low shrinkage
  • Thixotropic

Base: Epoxy

Curing: Two-part Chemical cure

Viscosity: Thixotropic paste

Pot Life: (in mixer nozzle at 23 C) 1 hour

Light Handling strength: (1MPa) @ 23 C 3 hours

product data sheet

FULL ARALDITE BROCHURE

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