Protecting electronic devices from the ingress of moisture and other materials, and staking larger components to add strength to them is very important to ensure a long working life for any device.
Traditionally this was done by using either an Epoxy or a Polyurethane compound which could be chemically cured ( two part systems ). Other options were heat cured systems, single part light curing products or RTV and heat cured silicones.
Power adhesives have now developed a hot melt potting compound which is extremely easy for the operator to use and this product offers a very good alternative to the traditional systems mentioned above.
Hot melts can be and extremely fast and easy solution for potting and encapsulating electronic components in certain applications, these products come in very convenient 12 mm slugs which can be dispensed cleanly and efficiently from one of the many Power Adhesives hot melt gun options.
Orthopedic implant manufacturing
Where they are ideally suited to temporary masking of parts for polishing and coating process and for packaging.
Where they are ideal for temporary masking of circuit board components.