Graphic illustrating Tecbond 7718 hot melt potting compounds

Safeguard Your Electronics with Tecbond 7718

The Ultimate Fire Retardant Potting Solution from Power Adhesives

At ECT Adhesives, we’re constantly striving to innovate and provide solutions that meet the needs of our customers. This month, we’re thrilled to introduce a groundbreaking advancement in electronics potting and encapsulation – Tecbond 7718 Polyamide Hot Melt from Power Adhesives.

In the fast-paced world of electronics manufacturing, efficiency and safety are paramount. The Tecbond 7718 adhesive has been designed with these critical factors in mind. As a low viscosity, fire retardant polyamide, it offers a quick, reliable, and safe method for potting and encapsulating electronic components.

Why Choose Tecbond 7718?

  • Fast & Convenient Hot Melt
  • Fire Retardant: Meets the UL-V0 flammability rating
  • Very Low Viscosity & Sets Hard
  • Quick Setting
  • Zero Waste
  • Suitable for Use with Power Adhesives Hot Melt Guns

We are more than happy to call to you and demonstrate this product and show how we can make your products better and your workplace more efficient.

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