Key Features:
- Medium viscosity for controlled application
- Solvent-free formulation
- Excellent electrical conductivity
- High thermal conductivity
- Flexible bonding properties
- Rapid curing with thermode compatibility
Base: Modified epoxy
Curing: One-part heat cure
Viscosity: 10,000 to 15,000 mPas
Volume resistivity: 1 × 10⁻⁴ to 3 × 10⁻⁴ Ohm·cm
Thermal conductivity: 3.0 to 4.0 W/mK
Perfect for applications such as die attach and conductive bonding where precision and performance are essential.
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