Araldite 2014-2

Gap filling, room temperature curing adhesive, producing very little outgassing when curing, making it ideal for specialised electronics, telecommunication, and aerospace applications. With a high temperature resistance to 120°C and excellent resistance to water and chemicals, the adhesive provides a good bond to a wide variety of substrates.

Key Features:

Excellent resistance to water and chemicals

Grey Paste

High temperature and chemical resistance

Gap filling and non-sagging up to 5mm thickness

Low shrinkage

Thixotropic

Base: Epoxy

Curing: Two-part Chemical cure

Viscosity: Thixotropic paste

Pot Life: (in mixer nozzle at 23 C) 1 hour

Light Handling strength: (1MPa) @ 23 C 3 hours