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Gap filling, room temperature curing adhesive, producing very little outgassing when curing, making it ideal for specialised electronics, telecommunication, and aerospace applications. With a high temperature resistance to 120°C and excellent resistance to water and chemicals, the adhesive provides a good bond to a wide variety of substrates.
Key Features:
- Excellent resistance to water and chemicals
- Grey Paste
- High temperature and chemical resistance
- Gap filling and non-sagging up to 5mm thickness
- Low shrinkage
- Thixotropic
Base: Epoxy
Curing: Two-part Chemical cure
Viscosity: Thixotropic paste
Pot Life: (in mixer nozzle at 23 C) 1 hour
Light Handling strength: (1MPa) @ 23 C 3 hours
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