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New thermally conductive adhesive for heat sensitive components

Elecolit® 6607 adhesive from Panacol is a thermally conductive adhesive and can be oven cured at temperatures as low as 80°C.

Elecolit® 6607 is an epoxy resin-based adhesive filled with aluminium oxide. It is a one-component system and due to its flow characteristics, it can be applied by dispenser, screen printing or spatula. Since Elecolit® 6607 cures at temperatures as low as 80°C, even heat-sensitive components can be bonded together. Curing at higher temperatures will shorten the curing time.

After curing, the light gray adhesive insulates electrically and provides excellent heat transfer with a thermal conductivity of 1.3 W/m*K.  Due to its properties, Elecolit® 6607 is particularly suitable for bonding metal components and heat sinks to electronic circuit boards.

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