New thermally conductive adhesive for heat sensitive components
Elecolit® 6607 adhesive from Panacol is a thermally conductive adhesive and can be oven cured at temperatures as low as 80°C.
Elecolit® 6607 is an epoxy resin-based adhesive filled with aluminium oxide. It is a one-component system and due to its flow characteristics, it can be applied by dispenser, screen printing or spatula. Since Elecolit® 6607 cures at temperatures as low as 80°C, even heat-sensitive components can be bonded together. Curing at higher temperatures will shorten the curing time.
After curing, the light gray adhesive insulates electrically and provides excellent heat transfer with a thermal conductivity of 1.3 W/m*K. Due to its properties, Elecolit® 6607 is particularly suitable for bonding metal components and heat sinks to electronic circuit boards.
