Light cure single part encapsulant.
Key Features
- Designed for flexible circuit boards
- Very high adhesion to metals
- Jettable
- Cures in seconds when exposed to high-intensity light.
Base Epoxy
Curing Light curing with secondary heat cure for shadowed areas.
Viscosity 18,000-23,000 mPas
Thermal conductivity 0.2 W/mK
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