Light cure single part encapsulant.
Key Features
- Suited for smaller dies
- Flexible
- Low water absorption
- Particle size max. 150 μm
Base Epoxy
Curing One-part light cured
Viscosity 6,000 to 9,000mPas
Thermal conductivity 0.20 W/mK
Light cure single part encapsulant.
Key Features
Base Epoxy
Curing One-part light cured
Viscosity 6,000 to 9,000mPas
Thermal conductivity 0.20 W/mK
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