One-part heat-cured silver-filled epoxy adhesive with high thermal and electrical conductivity
Key Features:
- Low viscosity
- Easy to dispense
- Fine grade fillers
- High Electrical conductivity
- High thermally conductive
Base: Epoxy
Curing: One-part heat cure
Viscosity: 4,000 to 5,000 mPas
Volume resistivity:Â 0.015 Ohm*cm
Thermal conductivity: 2.00 W/mK
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