RIEPE LPZ/II® is a precision-engineered release agent designed to prevent glue residues from sticking to the workpiece during edgebanding. Applied to the upper and lower edge areas before pre-milling, it stops unwanted adhesive build-up from PUR, EVA, and PO glues.

🔹 Prevents glue adhesion on workpiece edges
🔹 Essential for clean and consistent edgebanding
🔹 Transparent formula, suitable for all surface finishes
🔹 Extremely economical – less than 1L per 5,000m
🔹 Available in 10L and 30L containers

Now in stock at ECT!