LPZ/II® Release Agent – Effortless Adhesive Control from RIEPE
RIEPE LPZ/II® is a precision-engineered release agent designed to prevent glue residues from sticking to the workpiece during edgebanding. Applied to the upper and lower edge areas before pre-milling, it stops unwanted adhesive build-up from PUR, EVA, and PO glues. 🔹 Prevents glue adhesion on workpiece edges 🔹 Essential for clean and consistent edgebanding 🔹 […]
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