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Friday, 05 March 2021 / Published in Electronics, News

The Power to Imagine series – High Performance Frame and Fill adhesives.

Frame-and-fill processes are used to protect highly complex areas on electronic circuit boards.

The process simply is as follows:

Step one, a highly viscous barrier – the so-called frame – is applied.

Step two, this area is quickly filled with a much lower viscosity filler material – the Fill.

With this precise process, areas on the circuit board can be protected from mechanical impact factors.  The combination of Frame and Fill materials allows the application of minimum barrier and potting heights and cures to a homogeneous coating.

Panacol’s new Frame and Fill adhesives are perfectly matched so that the frame and fill areas can be optimally dispensed without these adhesives flowing to undesired areas on the PCB.

The Frame material, Structalit® 5704, is a black, thermally curable single-component epoxy. This frame and glob top compound features excellent bead stability and high glass transition temperature of 150°C up to 190°C, depending on the curing parameters and the layer thicknesses. When using Structalit® 5704, no bleeding effects occur. Due to the very low ionic content of less than 20 ppm, Structalit® 5704 is also suitable for chip encapsulation on electronic circuit boards.

As a Fill material, Panacol has developed a range of adhesives with different rheological properties. The adhesives Structalit® 5717 to Structalit® 5721 are formulated with optimised flow behavior, so that the adhesives can be used on various chip and wire bonding geometries due to the differently adjusted viscosities.

Since the Fills have the same chemical base as the Frame material, the excellent physical and chemical properties of high glass transition range, ionic purity, temperature stability and minimal shrinkage behavior are also found in the fill materials.

Once cured, Structalit® 5704 and the matching fill of the Structalit® 5717-5721 series form a black, opaque and scratch-resistant coating. These properties together with a temperature resistance of up to 200°C ensure maximum reliability and stability into the future.

ECT Adhesives – The Power to Imagine a better manufacturing future.

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    20 May 1527603759882326017

    ECT will be exhibiting at 8th National Manufacturing & Supply Chain Conference and Exhibition which will be held at the RDS Simmonscourt, Dublin on the 25th and 26th of May 2022.
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    11 May 1524411071351644161

    Hot melts can be and extremely fast and easy solution for potting and encapsulating electronic components protecting your device from the ingress of moisture or for staking larger components to add strength to them. https://zcu.io/iY08 #electronics #electricalengineering

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    7 Apr 1512082926585868290

    ECT are very proud to now offer the full range of PIZZI dispensing solutions to ensure our customers get the best possible results when applying their adhesives. https://zcu.io/FV4m
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    23 Mar 1506727737658118145

    Structalit® 5801 is a new 2-component adhesive system which is an ideal material for the structural bonding and potting of electronic components that require the highest level of environmental protection.https://zcu.io/VjcN #ectadhesives #panacol #innovation

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    9 Mar 1501611526666559495

    The DCK800X dispensing consumables kit includes a full range of blunt end, tapered, angled, flexible, PTFE lined and economy brush tips; which will alloy you to evaluate these products and select the most appropriate dispense tip for your application. #ectadhesives #fisnar

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