Heat cure thermally conductive silicone encapsulant and adhesive

Medium viscosity Epoxy potting and encapsulating compound.

Two-part heat chemical silicone encapsulant with high thermal conductivity.

Heat cured silicone encapsulant and adhesive with high thermal conductivity

Thermally conductive and flame-retardant epoxy potting compound with a high…

Thermally conductive and flame-retardant epoxy potting and encapsulating compound