Single part heat epoxy underfill for consumer electronics which is reworkable and has a built in fluorescence for easy inspection.
Underfill material which will equalize the stresses between chip and substrate.
Bonding components on PCB’s
Reinforcement and support of solder joints
Compatible with edge bond Structalit® 5705
Re-workable above 150°C
Curing: Single part heat cure.
Viscosity: 200-500 mPas
Shore Hardness: 75-90D