Structalit® 5751

Single part heat epoxy underfill for consumer electronics which is reworkable  and has a built in fluorescence for easy inspection.

Key Features

Underfill material which will equalize  the stresses between chip and substrate.

Bonding components on PCB’s

Reinforcement and support of solder joints

Halogen free

Compatible with edge bond Structalit® 5705

Re-workable above 150°C


Base:  Epoxy

Curing: Single part heat cure.

Viscosity: 200-500 mPas

Fluorescing: Yes

Shore Hardness:  75-90D


ECT Adhesive Solutions, Unit 5, Willsborough Industrial Estate, Clonshaugh, Dublin D17 X336.

+353 1 885 0000