Structalit® 5751
Single part heat epoxy underfill for consumer electronics which is reworkable and has a built in fluorescence for easy inspection.
Key Features
Underfill material which will equalize the stresses between chip and substrate.
Bonding components on PCB’s
Reinforcement and support of solder joints
Halogen free
Compatible with edge bond Structalit® 5705
Re-workable above 150°C
Fluoresces
Base: Epoxy
Curing: Single part heat cure.
Viscosity: 200-500 mPas
Fluorescing: Yes
Shore Hardness: 75-90D
- CATEGORY Conformal coatings products , Electronics , Panacol , Potting and encapsulating , Single Part Heat Curing , Structalit
- TAGS Epoxy adhesives , panacol , Structalit , underfill material