Power Adhesives Tecbond 7718

TECBOND 7718 is a Low viscosity fire retardant polyamide for potting and encapsulating applications in the electronics industry. Tecbond 7718 has a very low viscosity that sets very hard. It is suitable for potting and encapsulation in the electronics industry. Available in amber and black.

Potting and Encapsulation: Tecbond 7718 has been tested for use in electrical / electronic applications. TECBOND 7718 is fire retardant and would meet the UL-V0 flammability rating. The use of hotmelt speeds up assembly as there is no mixing and any unused adhesive remains in the glue gun ready for next time, so there is no waste.

Setting time is usually less than 2 minutes. Coloured versions of the adhesive are available which can be useful to hide components or colour code for traceability.

Key features:

Simple alternative to two part potting compounds

Very fast cure time

Clean to use no mixing required

Available in amber and black

Packaging: 5 kg box for 15 mm


ECT Adhesive Solutions, Unit 5, Willsborough Industrial Estate, Clonshaugh Business and Technology Park, Dublin 17, Ireland

+353 1 885 0000