CHT SE 2003

Two-part heat cure silicone encapsulant with high thermal conductivity.

Key Features:

Room temperature cure

Non-corrosive

Excellent thermal conductivity

Resistant to reversion

Base: Silicone

Curing: Two-Part chemical cured

Viscosity: 35,000 mPas

Thermal conductivity: 1.27 W/mK

CONTACT INFO

ECT Adhesive Solutions, Unit 5, Willsborough Industrial Estate, Clonshaugh, Dublin D17 X336.

+353 1 885 0000

info@ect.ie

orders@ect.ie

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