CHT AS 1421

One-part heat cured silicone encapsulant and adhesive with high thermal conductivity.

Key Features:

UL94V0 approved file Number E334038

Adhesion and 3mm cure through at 125°C after only 10 minutes

Thermally conductive

Base: Silicone

Curing: One Part heat cured

Viscosity: 140,000 mPas

Thermal conductivity: 2.1 W/mK

Certification: UL94 V-0