CHT AS 1421
One-part heat cured silicone encapsulant and adhesive with high thermal conductivity.
UL94V0 approved file Number E334038
Adhesion and 3mm cure through at 125°C after only 10 minutes
Curing: One Part heat cured
Viscosity: 140,000 mPas
Thermal conductivity: 2.1 W/mK
Certification: UL94 V-0