CHT AS 1420
One-part heat cure silicone thermally conductive adhesive and encapsulant.
Key Features:
UL94V0 approved file Number E334038
Adhesion and 3mm cure through at 125°C after only 10 minutes
Thermally conductive
Base: Silicone
Curing: One Part heat cured
Viscosity: 43,000 mPas
Thermal conductivity: 1.38 W/mK