Protecting electronic devices from the ingress of moisture and other materials. Also staking larger components to add strength to them is very important to ensure a long working life for any device.
Traditionally this was done by using either an Epoxy or a Polyurethane compound which could be chemically cured ( two part systems ). Other options were heat cured systems, single part light curing products or RTV and heat cured silicones.
Power adhesives have now developed a hot melt potting compound which is extremely easy for the operator to use. This product offers a very good alternative to the traditional systems mentioned above.
Hot melts can be and extremely fast and easy solution for potting and encapsulating electronic components in certain applications. Also efficiently from one of the many Power Adhesives hot melt gun options.
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