Single Part Heat Curing

Some modern circuit boards can produce a large amount of heat.  In these cases it is very important to conduct this heat away from the components as quickly and efficiently as possible. Our range of single part heat curing thermally conductive adhesives are ideal for applications where you can heat cure the adhesive as this gives you the simplest dispensing solutions and the fastest cycle times.

Elecolit 6601

Heat cured thermally conductive epoxy adhesive

CHT AS 1421 heat curing Silicone encapsulant image - ect adhesives

CHT AS 1421

Heat cured silicone encapsulant and adhesive with high thermal conductivity

Panacol elecolit 6603 thermally conductive adhesive image - ECT adhesives

Elecolit 6603

Heat cured thermally conductive epoxy adhesive

CHT AS 1420 heat curing adhesive image - ECT adhesives

CHT AS 1420

Heat cure thermally conductive silicone encapsulant and adhesive

Panacol elecolit 6607 thermally conductive adhesive image - ECT adhesives

Elecolit 6607

Low temperature cured thermally conductive epoxy adhesive

Structalit 5751 image - ECT Adhesives

Structalit® 5751

Single part heat only cured underfill material

Structalit® 5858 is a modified, one-component epoxy resin adhesive that was developed specifically for bonding magnets into electric motors.

Structalit® 5858

Heat cured adhesive for magnet bonding

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