Hot Melts can be fast and easy solution for potting and encapsulating electronic components

A new manufacturing process has been developed using a black polyamide potting compound that can be dispensed through conventional 12mm (½″) hot melt glue guns. This process has been specifically designed for the electronic,automotive and aerospace industries.
For small scale manafacturing with not very demanding applications this can be a very good alternative to the traditional polyurethane, Epoxy and silicone based potting compounds.