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Saturday, 22 October 2022 / Published in Chemistry, Electronics, Hot Melts, Industries

Electronics grade epoxies that cure at 60°C for heat sensitive components!

Panacol has developed a range of new one component epoxy adhesives that cure at very low temperatures.

These new adhesives were developed specifically for electronics applications and adhere very well to substrates with low surface energy.

With the adhesives Structalit® 5511, 5521 and 5531, a range of adhesives has been developed that exhibit a unique set of physical properties after reaching full cure. This allows the engineer to optimize the adhesive with various component geometries, substrates, and operating functions.

All three adhesives are single-component, epoxy resin-based adhesives and cure at just 60°C.

Making them particularly suitable for temperature-sensitive electronic components. Curing at higher temperatures will accelerate cure time and add additional strength to the bond.

Structalit® 5511 adhesive features a particularly low ionic content and is therefore especially suitable for use in electronics. Combining a high Young’s modulus with an elongation at break of more than 8%. This ensures high adhesion to many substrates with additional shock. Also ensures vibration resistance.

 

Click for Structalit® 5511 full product details

 

Structalit® 5521 is softer and more flexible after curing, allowing the adhesive to better compensate for stresses between substrates. Due to its very low modulus of elasticity, this adhesive is very well suited for potting or for the application

Click for Structalit® 5521 full product details

 

The third adhesive of the new epoxy technology, Structalit® 5531 has an extraordinarily low coefficient of thermal expansion (CTE), yet is flexible enough to withstand drop and vibration tests.

The incorporation of filler particles gives the adhesive extremely high resistance to mechanical and chemical influences. Structalit® 5531 data sheet available here

 

Click for Structalit® 5531 full product details

 

These Structalit® adhesives from Panacol generate very high bond strength with materials typically used in the electronics industry. They can also adhere very well to LCP (liquid crystal polymer) and other high-tech plastics with low surface energy. All three adhesives possess high purity and low ion content which complies with international standards for electronic and microelectronic component assembly.

 

Click for full electronics assembly industry range

 

We are more than happy to call to you and demonstrate this product and show how we can make your products better . Also will make your workplace more efficient.

Just reply to this email and we can discuss how ECT adhesives can help you.

ECT Adhesives – The Power to Imagine a better manufacturing future.

Tagged under: Structalit® 5511, Structalit® 5521, Structalit® 5531

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