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Electronics

The Power to Imagine series – New Hot Melt Potting Compounds

Protecting electronic devices from the ingress of moisture and other materials, and staking larger components to add strength to them is very important to ensure a long working life for any device.   Traditionally this was done by using either an Epoxy or a Polyurethane compound which could be chemically cured ( two part systems ).  […]

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The Power to Imagine series – New epoxy adhesive for bonding magnets

Structalit® 5858 is a modified, one-component epoxy resin adhesive that was developed specifically for bonding magnets into electric motors. Its high bond strength and impact resistance ensures a completely reliable bond. Structalit® 5858 can be cured thermally in a convention oven at temperatures from 100°C.  It is also possible to use induction curing for faster

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The Power to Imagine series – New reworkable underfill which fluoresces for easy inspection!

New reworkable underfill which fluoresces for easy inspection. Panacol has developed a new reworkable underfill for consumer electronics. The reworkability of the new Structalit® 5751 adhesive allows manufacturers to reduce both manufacturing costs and environmental impact by reusing electronic components mounted on PCBs.  Although black in colour, it also fluoresces when exposed to black light.

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The Power to Imagine series – New removable masking solutions from Panacol

Protecting electronic devices from the ingress of moisture and other materials, and staking larger components to add strength to them is very important to ensure a long working life for any device.   Traditionally this was done by using either an Epoxy or a Polyurethane compound which could be chemically cured ( two part systems ). 

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The Power to Imagine series – Hand dispensing solutions from Fisnar!

Simple manual hand dispensing operations in R&D labs and manual production lines can be accomplished by using some of our simple hand dispensing solutions. These hand dispensers allow you to dispense materials directly for small syringes, cartridges, bottles, and dual cartridges. Fisnar offers a selection of hand dispensers including options like manual hand dispensers, time

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The Power to Imagine series – Electronics grade epoxies that cure at 60°C for heat sensitive components!

Illbruck have developed SP045 Multi Purpose Grab Adhesive This innovative product offers a multi purpose Grab adhesive in environmentally friendly 400ml foil sausages. It eliminates the need for switching between many different products as it offers primerless bonding and sealing of many common construction materials. Combining Strength and Flexibility   Elastic properties with adhesive and

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The Power to Imagine series – A Medical Grade Adhesive Which Is Electrically And Thermally Conductive!

Panacol has launched Elecolit® 323, a new biocompatible conductive adhesive. Elecolit® 323 is non-cytotoxic according to ISO 10993-5 and is thus suitable for applications in medical devices. The 2-component adhesive is the perfect solution to bond EP catheters and any medical device needing an electrically or thermally conductive adhesive. Other electrically and thermally conductive adhesive

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The Power to Imagine series – A thermally conductive adhesive for heat sensitive components!

Elecolit® 6607 is an epoxy resin-based adhesive filled with aluminium oxide. It is a one-component adhesive and due to its flow characteristics, it can be applied by dispenser, screen printing or spatula. Since Elecolit® 6607 cures at temperatures as low as 80°C, even heat-sensitive components can be bonded together. Curing at higher temperatures will shorten the curing

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The Power to Imagine Series – High Performance Frame and Fill adhesives.

Frame-and-fill processes are used to protect highly complex areas on electronic circuit boards. The process simply is as follows: Step one, a highly viscous barrier – the so-called frame – is applied. Step two, this area is quickly filled with a much lower viscosity filler material – the Fill. With this precise process, areas on

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The Power to Imagine series – New epoxy adhesive which offers maximum protection for potting applications

Panacol, Structalit® 5801 is a new 2-component adhesive system that demonstrates exceptional chemical and moisture resistance after accelerated aging.  This resistance makes Structalit® 5801 an ideal material for the structural bonding and potting of electronic components that require the highest level of environmental protection. Structalit® 5801 is a black, 2-component epoxy adhesive system with a

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